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Patent Searching and Data


Title:
MOBILE PHONE
Document Type and Number:
Japanese Patent JP2007028094
Kind Code:
A
Abstract:

To provide a mobile phone capable of suppressing heating at a dense circuit part is suppressed by isolating a circuit board.

An electric board 3 on which a radio circuit 6 that generates much heat is mounted and a charging circuit board 5 on which a charging circuit 2 that generates much heat are arranged across a battery 4. Congestion of heating parts mounted on a lower case 1b is avoided, to prevent partial rising in temperature of a mobile phone 1. A flexible board 11 is connected to the charging circuit board 5 by way of a surface of the battery 4 which is a rear surface side when viewed from a surface of the electric board 3 on which a connector 9 is mounted. So even if the lower case 1b is deformed, the flexible board 11 is pulled from both boards, thereby preventing coming off of the connector 9 from the electric board 3.


Inventors:
YAMADA HIROYASU
Application Number:
JP2005206007A
Publication Date:
February 01, 2007
Filing Date:
July 14, 2005
Export Citation:
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Assignee:
NEC ACCESS TECHNICA LTD
International Classes:
H04M1/02
Attorney, Agent or Firm:
Takao Maruyama