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Title:
MODIFIED SILICONE ADHESIVE HAVING HIGH THIXOTROPIC NATURE
Document Type and Number:
Japanese Patent JPH11349916
Kind Code:
A
Abstract:

To produce a modified silicone adhesive having sufficiently high thixotropic nature and suppressed stringiness and useful for the bonding of tile, etc., for the facing of outer wall on the building site by using a modified silicone polymer as a main component and compounding a specific amount of rubber powder having a specific particle diameter to the polymer.

The objective adhesive is produced by using a modified silicone polymer (preferably a polymer containing polyoxypropylene ether as the main chain and having a molecular weight of 8,000-15,000) as a main component and compounding rubber powder having particle diameter of 10-500 μm, preferably 10-200 μm to the polymer in an amount to give an adhesive having a rubber content of 5-15 wt.%, preferably 5-12 wt.%. As necessary, the adhesive is compounded with a silane coupling agent such as aminoalkoxysilane. The amount of the silane coupling agent is usually 4-10 pts.wt. based on 100 pts.wt. of the rubber powder. Preferably, the rubber powder is pretreated by adding and mixing a part of the silane coupling agent to the rubber powder before use.


Inventors:
MORI HARUHIKO
SUGIMORI MASARU
ONISHI MAKIKO
Application Number:
JP15740098A
Publication Date:
December 21, 1999
Filing Date:
June 05, 1998
Export Citation:
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Assignee:
SUNSTAR ENGINEERING INC
International Classes:
C08G65/32; C09J121/00; C09J171/02; C09J183/12; (IPC1-7): C09J183/12; C09J121/00
Attorney, Agent or Firm:
Aoyama Ryo (1 person outside)