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Title:
Modular wearing type sensor apparatus
Document Type and Number:
Japanese Patent JP6021164
Kind Code:
B2
Abstract:
A wearable sensor and method for providing a wearable sensor are disclosed. In a first aspect, the wearable sensor comprises a first module, wherein the first module comprises a top layer, a printed circuit board (PCB) layer, and a bottom layer. The bottom layer comprises a double adhesive layer that adheres to both the PCB layer and the user. The bottom layer includes at least two openings to house at least two electrodes for monitoring of a user. The wearable sensor further comprises a second module coupled to the first module, wherein the first module is disposable and the second module is reusable. In a second aspect, the method comprises providing the aforementioned wearable sensor.

Inventors:
Yang, Yun
Sahabi, Ajin
Application Number:
JP2015514163A
Publication Date:
November 09, 2016
Filing Date:
May 22, 2013
Export Citation:
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Assignee:
Vital Connect,Inc.
International Classes:
A61B5/00; A61B5/08; A61B5/332
Domestic Patent References:
JP2010234047A
JP2007512865A
Foreign References:
WO2011076886A2
WO2010077851A2
Attorney, Agent or Firm:
Koichi Washida