Title:
モジュール−端子台接続構造及び接続方法
Document Type and Number:
Japanese Patent JP6488688
Kind Code:
B2
Abstract:
A module - terminal block connection structure includes: a printed wiring board; a terminal block which is disposed on one surface of the printed wiring board and is formed into a three-dimensional shape by a conductive material, the terminal block being fixed to the printed wiring board; a power module which is disposed on the other surface (rear surface) of the printed wiring board and includes an electric circuit and a press-fit type lead pin used as a circuit terminal; and a conductive portion which is electrically connected to the terminal block, includes a hole (through-hole) for press-inserting the lead pin thereinto, and is electrically connected to the power module while the lead pin is press-inserted into the hole.
Inventors:
Keiji Kodera
Hiroi Doi
Masayasu Hiraoka
Hiroshi Domae
Michiya Takezoe
Takuji Koyama
Hiroi Doi
Masayasu Hiraoka
Hiroshi Domae
Michiya Takezoe
Takuji Koyama
Application Number:
JP2014255381A
Publication Date:
March 27, 2019
Filing Date:
December 17, 2014
Export Citation:
Assignee:
Daikin Industries, Ltd.
International Classes:
H01R9/22; H01R12/51
Domestic Patent References:
| JP6302932A | ||||
| JP58025051U | ||||
| JP2137052U |
Attorney, Agent or Firm:
Patent Business Corporation Suncrest International Patent Office