MODULE CONNECTING CONDUCTIVE PASTE AND IC CARD

Title:

MODULE CONNECTING CONDUCTIVE PASTE AND IC CARD

Document Type and Number:

Japanese Patent JP2010176894

Kind Code:

A

Abstract:

To provide a conductive paste which gives high connection reliability to a product as thin as an IC card and subjected to a stress on use to allow the product to endure the stress and prevent a contact from breaking.

An IC card is provided with a module connecting conductive paste 5 containing essential components of (A) a urethane acrylate resin, (B) an acrylic monomer, (C) an organic peroxide, (D) conductive powder, and (E) a metallic soap, and an IC chip 1. In this IC card, the IC chip 1 is connected electrically to a card substrate 4 via the module connecting conductive paste.

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Inventors:

ANAMI TAKESHI
OGASAWARA HIROSHI
YOSHIDA NAOKI

Application Number:

JP2009015650A

Publication Date:

August 12, 2010

Filing Date:

January 27, 2009

Export Citation:

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Assignee:

KYOCERA CHEM CORP

International Classes:

H01B1/22; B42D15/10; G06K19/077

Attorney, Agent or Firm:

Saichi Suyama
Yukio Kawahara
Satoshi Yamashita
Hideaki Suyama

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