To provide a module capable of anticipating failure of a circuit board containing a junction part of an active element by detecting such fractures, corresponding to, for example, a junction part of a bonding material for connecting the active element and a circuit pattern, as caused by Kirkendall voids and electromigration.
In the module including a circuit board containing a circuit pattern formed of a first conductor, a bonding material formed of a second conductor which is different from the first conductor, a passive element and an active element joined to the circuit pattern by the bonding material, and a detection circuit provided separately from a signal circuit to the circuit board, the detection circuit includes a detector which is provided to the circuit board for connecting the first conductor electrically to the second conductor, a power supply part which feeds a current to the detector, and a measurment part which is sandwiched between one conductor of the detector and the power supply, for measuring electrical characteristics between the first and second conductors.
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YAMAMOTO NOBUHIRO
| JP2003004794A | 2003-01-08 | |||
| JP2009257863A | 2009-11-05 | |||
| JPH1187003A | 1999-03-30 |
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Katsumura Hiro
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen