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Title:
MODULE MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2012028485
Kind Code:
A
Abstract:

To provide a module having excellent radiation performance.

The module manufacturing method of the present invention comprises the steps of placing a substrate 22 above a resin tub 63 in a state where a semiconductor device 24a lies with its face down, softening non-fluidized resin 25a loaded in the resin tub 63 until fluidization occurs while sucking air in a space formed between the substrate 22 and the resin 25a, dipping the semiconductor device 24a into the softened resin 25a while contacting an undersurface of the substrate 22 with a liquid level of the resin 25a, subsequently compressing the resin 25a until a resin part 25 has a specified dimension, subsequently hardening the resin 25a to form the resin part 25 on the substrate 22, and subsequently forming a heat radiation film 26. Accordingly, the resin 25a can be easily filled even in a narrow gap thereby decreasing a distance between the semiconductor device 24a and the heat radiation film 26.


Inventors:
KIMURA JUNICHI
Application Number:
JP2010164561A
Publication Date:
February 09, 2012
Filing Date:
July 22, 2010
Export Citation:
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Assignee:
PANASONIC CORP
International Classes:
H01L21/56; H01L23/28
Domestic Patent References:
JP2009181970A2009-08-13
JP2004297054A2004-10-21
JP2006027098A2006-02-02
JP2005109135A2005-04-21
JP2009060071A2009-03-19
Attorney, Agent or Firm:
Hiroki Naito
Daisuke Nagano
Kentaro Fujii



 
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