To provide an IC chip packaging module capable of suppressing only unneeded radio waves without losing desired radio waves for the operation of an IC chip.

When packaging the IC chip 1 in a module 10 having a cavity, only the radio waves in the direction of one axis are absorbed, and an anisotropic radio wave absorber 5 for transmitting radio waves in the other directions is arranged close to the surface of the IC chip 1, so that the direction of the electric field in a signal that is not required for operating the IC chip 1 becomes parallel with a direction in which the anisotropic radio wave absorber 5 absorbs radio waves. As the anisotropic radio wave absorber 5, for example, a plurality of isotropic radio wave absorbing materials are arranged in a penholder arrangement in a rectangular parallelepiped shape or a cylindrical shape, where length in the direction of one axis is equal to or more than 1/4 the wavelength of the radio waves and length in the other directions is fully smaller than 1/4 the wavelength of radio waves. Or, an anisotropic radio wave absorber for transmitting only radio waves in the direction of one axis is used, so that the direction for transmitting radio waves is in parallel with the direction of the electric field required for operating the IC chip.

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