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Title:
MOISTURE CURABLE RESIN COMPOSITION AND CURED PRODUCT
Document Type and Number:
Japanese Patent JP2021008600
Kind Code:
A
Abstract:
To provide a moisture curable resin composition that ensures compatibility between initial moisture curing properties with appropriately excellent workability and moisture curing properties after a storage stability test.SOLUTION: A moisture curable resin composition contains (A) to (C) components described below, wherein the moisture curable resin composition contains 0.03 to 0.9 pts.mass of the (C) component with respect to 100 pts.mass of the (A) component. (A) Component: a curable resin that has a main chain skeleton containing polyoxyalkylene and has a hydrolyzable silyl group. (B) Component: a moisture curing catalyst containing a fluorine-based compound. (C) Component: zeolite having a pore diameter of 5 to 30 angstroms.SELECTED DRAWING: None

Inventors:
KOSAKA TAKAHITO
Application Number:
JP2020101769A
Publication Date:
January 28, 2021
Filing Date:
June 11, 2020
Export Citation:
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Assignee:
THREE BOND CO LTD
International Classes:
C08L71/02; C08G18/32; C08G18/38; C08K3/013; C08K3/34; C08K3/38; C08K5/54; C08L75/06; C09J11/04; C09J11/06; C09J171/02; C09J175/04; C09K3/10
Domestic Patent References:
JP2005281404A2005-10-13
JP2006199725A2006-08-03
JP2015105293A2015-06-08
JP2008007586A2008-01-17
JP2002338932A2002-11-27
JP2009114258A2009-05-28
Attorney, Agent or Firm:
Hatta International Patent Corporation