To obtain a moisture-curing adhesive composition causing little shift of a board, or the like, bonded to a wall with the adhesive.

This moisture-curing adhesive composition is produced by compounding a moisture-curing liquid adhesive with fibrillated fibers and fibers having low fibrillation degree. The fiber having the low fibrillation degree means a fiber having a fibrillation degree lower than the fibrillated fiber. The fiber having the low fibrillation degree may be a non-fibrillated fiber free from fibril or a fiber containing fibril. The fibrillated fiber is preferably a fibrillated aromatic polyamide fiber and the fiber having low fibrillation degree is preferably a fibrillated polyethylene fiber and/or sepiolite. The moisture-curing liquid adhesive is preferably a modified silicone adhesive or a urethane adhesive. The compounding amount of the fibrillated fiber and the fiber having the low fibrillation degree is 0.1-50 pts.wt. each based on 100 pts.wt. of the moisture- curing liquid adhesive.