MOISTURE-CURING TYPE ADHESIVE COMPOSITION

Title:

MOISTURE-CURING TYPE ADHESIVE COMPOSITION

Document Type and Number:

Japanese Patent JP2022134674

Kind Code:

A

Abstract:

To provide a moisture-curing type adhesive composition that contains an organic polymer having a hydrolyzable silyl group and is a curable composition excellent in colorless transparency.SOLUTION: A moisture-curing type adhesive composition includes: a curable resin that is a component (A), has polyoxyalkylene as a main chain, and has a hydrolyzable silyl group represented by a following general formula (1) in a terminal thereof; a curable resin that is a component (B), has a vinyl copolymer as a main chain, and has a hydrolyzable silyl group represented by the following general formula (1) in a molecule; a boron trifluoride complex that is a component (C); and a fluorescent whitening agent that is a component (D). The general formula (1); -SiR1a(OR2)3-n, wherein R1 represents an alkyl group having 1 to 10 carbon atoms, R2 represents an alkyl group having 1 to 6 carbon atoms, and a is 0, 1 or 2.SELECTED DRAWING: None

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Inventors:

IYO KAZUHIRO
KOSHIO NORIHIRO

Application Number:

JP2021033968A

Publication Date:

September 15, 2022

Filing Date:

March 03, 2021

Export Citation:

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Assignee:

KONISHI CO LTD

International Classes:

C09J171/02; C09J11/06

Attorney, Agent or Firm:

Kenji Yokoi
Satoshi Yokoi
Hiroshi Yokoi

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