Title:
MOISTURE-PROOF INSULATION COATING FOR PACKAGING CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2011162576
Kind Code:
A
Abstract:
To provide a moisture-proof insulation coating for a packaging circuit board having excellent close-adhesion property to a glass substrate and capable of being cleanly peeled off without being deposited on the glass substrate at peeling off.
The moisture-proof insulation coating for the packaging circuit board contains (A) a styrene block copolymer having a carboxyl group and/or an acid anhydride group in the molecule and (B) an organic solvent as indispensable components. The component (A) is preferably a styrene-butadiene-maleic anhydride copolymer, a styrene-isoprene-maleic anhydride copolymer, a styrene-ethylene-butylene-maleic anhydride copolymer or a styrene-ethylene-propylene-maleic anhydride copolymer.
Inventors:
OGA KAZUHIKO
HIGASHI RITSUKO
HIGASHI RITSUKO
Application Number:
JP2010023100A
Publication Date:
August 25, 2011
Filing Date:
February 04, 2010
Export Citation:
Assignee:
SHOWA DENKO KK
International Classes:
C09D153/00; C08F2/44; C08F279/02; C08F297/00; C09D5/25; C09D7/12; C09D153/02; H01B3/30
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Yoshihiro Kobayashi
Atsushi Ebiya
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Yoshihiro Kobayashi
Atsushi Ebiya
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