Title:
MOLD APPARATUS FOR INJECTION MOLDING
Document Type and Number:
Japanese Patent JP3160888
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To accurately control the pressure or amt. of the thermoplastic resin to be filled into a cavity.
SOLUTION: A spring 61 is provided between a first mold member 34 and a second mold member 33 and, at first, both mold members are clamped by weak mold clamping force to fill a cavity 35 with a resin. When the supply of the resin is continued, both mold members 33, 34 are slightly opened by the pressure of the resin. By this constitution, the irregularity of the amt. of the resin from a molding machine is absorbed and the pressure of the resin within the cavity 35 is made constant. Next, the mold members are clamped by strong clamping force to be perfectly closed. Accompanied by this, the resin within the cavity 35 returns to the molding machine. The gate colsure part 55 of the second mold member 33 is fitted to the direct gate 47 provided to the first mold member 34 and, at a point of time when the gate 47 is closed, a definite amt. of the resin remains within the cavity 35. Thereafter, the resin within the cavity 35 is compressed.
Inventors:
Yoshinobu Takeda
Application Number:
JP5288796A
Publication Date:
April 25, 2001
Filing Date:
March 11, 1996
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
B29C45/26; B29C45/38; (IPC1-7): B29C45/26
Domestic Patent References:
| JP1209119A | ||||
| JP6297513A | ||||
| JP7329125A | ||||
| JP5574849A | ||||
| JP7232358A | ||||
| JP671698A | ||||
| JP7329124A | ||||
| JP58130714U |
Attorney, Agent or Firm:
Ushiki Mamoru (1 person outside)