Title:
MOLD APPARATUS FOR MOLDING
Document Type and Number:
Japanese Patent JP3003124
Kind Code:
B2
Abstract:
PURPOSE: To enable liquid tightness to be maintained positively by fitting a gate bush into a fitting hole formed in a cavity member, and fixing the gate bush and cavity member mutually in diffused joint relation.
CONSTITUTION: On the stationary mold 1, a cavity member 12 having a cavity forming surface 12a and a gate bush 71 having a gate 13 embedded in the cavity member 12 and opened to the cavity 12 are provided. A cooling liquid path 53 is formed between the cavity member 12 and the gate bush 71. The gate bush 71 is fitted into a fitting hole 52 formed in the cavity member 12, and fixed therein in diffused joint relation. Namely, the gate bush 71 fitted in the fitting hole 52 and the cavity member 12 are pressure-fixed by a jig and heated in a furnace, wherein the metallic atoms of both materials are diffused mutually to be jointed. At this time, they are activated by adding an assistant. Furthermore, quench hardening is effected simultaneously during the diffused joint. Accordingly, liquid tightness can be ensured positively by no use of rubber rings.
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Inventors:
Hisanori Tanabe
Hirofumi Tanabe
Hirofumi Tanabe
Application Number:
JP1231692A
Publication Date:
January 24, 2000
Filing Date:
January 27, 1992
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
B29C33/04; B29C33/38; B29C45/17; B29C45/26; B29C45/27; B29C45/73; (IPC1-7): B29C45/26; B29C33/38; B29C45/73
Domestic Patent References:
| JP6340688A | ||||
| JP383617A | ||||
| JP2292005A | ||||
| JP63246221A |
Attorney, Agent or Firm:
Ushiki Mamoru (1 person outside)