Title:
MOLD APPARATUS FOR RESIN MOLDING
Document Type and Number:
Japanese Patent JP2015013381
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To prevent leakage of a molten resin, especially a molten resin high in flowability, from a part of a pin hole.SOLUTION: A mold apparatus 1 for resin molding includes a valve gate 4 for injection of a molten resin 3 into a mold 2, a gate drive device 6 which drives a valve gate pin 5 executing opening and closing of the valve gate 4 and a resin passage 7 for supplying the molten resin 3 to the valve gate 4, and the resin passage 7 is joined halfway with a pin hole 8 arranged so as to be inserted with the valve gate pin 5. Between the joined part 9 of the pin hole 8 joined with the resin passage 7 and the gate drive device 6, seal bush 31 is provided to prevent leakage of the molten resin 3 flowing through the resin passage 7 from the joined part 9 through the pin hole 8 to the side of the gate drive device 6.
Inventors:
OKUBO ETSUO
SUGIMOTO KENJIRO
SASAKI SHINJI
SUGIMOTO KENJIRO
SASAKI SHINJI
Application Number:
JP2013139712A
Publication Date:
January 22, 2015
Filing Date:
July 03, 2013
Export Citation:
Assignee:
CALSONIC KANSEI CORP
International Classes:
B29C45/27
Domestic Patent References:
| JPH06339951A | 1994-12-13 | |||
| JPS63107528A | 1988-05-12 |
Foreign References:
| WO2010091070A1 | 2010-08-12 | |||
| US20120225159A1 | 2012-09-06 |
Attorney, Agent or Firm:
Tamio Nishiwaki
Nishiwaki History of 怜
Nishiwaki History of 怜