Title:
MOLD ASSEMBLY AND METHOD FOR MANUFACTURING MOLDED ARTICLE USING THE SAME
Document Type and Number:
Japanese Patent JP2003053787
Kind Code:
A
Abstract:
To provide a low cost mold assembly capable of adjusting the warp quantity generated in a molded article without replacing a mold itself and capable of certainly suppressing the warpage generated in the molded article after molding, and to provide a method for manufacturing the molded article using the same.
In the mold assembly 2 comprising a female mold 6 and a male mold 4 and molding a tub-shaped molded article 80 by a reactive injection molding method, a warp quantity correction mechanism 20 is provided for making at least a part of the product forming surface 10 formed to the male mold 4 movable relatively with respect to the female mold 6.
Inventors:
FUNAKI MASAHIRO
Application Number:
JP2001247702A
Publication Date:
February 26, 2003
Filing Date:
August 17, 2001
Export Citation:
Assignee:
NIPPON ZEON CO
International Classes:
B29C45/26; B29L24/00; (IPC1-7): B29C45/26
Attorney, Agent or Firm:
Hitoshi Maeda (2 outside)
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