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Title:
MOLD ASSEMBLY
Document Type and Number:
Japanese Patent JP2012106414
Kind Code:
A
Abstract:

To provide a mold assembly capable of molding a resin molded product by suppressing even the occurrence of a sink to a reinforcing rib.

The mold assembly is an apparatus for molding the resin molded product 20 having the reinforcing rib 29 provided to the back of the body part 21 thereof from thermosetting resin, and includes a mold part 1 for forming a cavity 4 composed of a body cavity part 5 and a rib cavity part 6, a filling means for filling the cavity 4 with the resin, a heating means for previously heating the resin from the surface thereof to cure the same, a pressurization means 8 for applying molding pressure to the resin at the time of heating, an air vent 11 for discharging the air in the cavity 4 at the time of injection of the resin and a replenishing means for replenishing the cavity 4 with the resin at the time of heating. The replenishing means replenishes the sink produced accompanied by the curing of the resin in the rib cavity part 6 with the resin through the air vent 11.


Inventors:
ISHIKURA KENTARO
KITA RYOTA
Application Number:
JP2010257125A
Publication Date:
June 07, 2012
Filing Date:
November 17, 2010
Export Citation:
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Assignee:
PANASONIC CORP
International Classes:
B29C39/26; B29C33/10
Attorney, Agent or Firm:
Keisei Nishikawa
Mizuhiji Katsuhisa
Takeshi Sakaguchi
Hidetoshi Kitade



 
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