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Patent Searching and Data


Title:
MOLD FRAME APPARATUS FOR CONCRETE SLAB
Document Type and Number:
Japanese Patent JPH03254907
Kind Code:
A
Abstract:

PURPOSE: To enable burying of an electric wiring box correctly by providing a box fixing material wherein elastically deformable engaging materials are oppositely provided on the inner wall of the electric wiring box.

CONSTITUTION: When a fixing material 10 is attached on a mold frame substrate 14 and an electric wiring box 11 is placed thereover, an electric parts attaching portion 13 of the electric wiring box 11 is engaged to an elastic engaging portion 12 of the fixing material 10 through the elastic force thereof and, therefore, positionally fixed on the fixing material 10. Accordingly, when concrete is flowed, buried, and vibrated therein, the electric wiring box 11 is, in a state of being positioned on the fixing material 10, positionally regulated by the elastic engagement of the elastic engaging portion 13, as a result, the displacement thereof is prevented and, thus, it is buried in the predetermined position of a concrete slab.


Inventors:
NIIMURA SHIGERU
Application Number:
JP5261290A
Publication Date:
November 13, 1991
Filing Date:
March 06, 1990
Export Citation:
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Assignee:
TOYOTA KOGYO KK
International Classes:
B28B7/00; B28B23/00; (IPC1-7): B28B7/00; B28B23/00
Domestic Patent References:
JPS5226889A1977-02-28
Attorney, Agent or Firm:
Takehiko Suzue (3 outside)