Title:
MOLD IC PITCH CONVERTING MECHANISM
Document Type and Number:
Japanese Patent JPS6260706
Kind Code:
A
Abstract:
PURPOSE: To quicken the conversion of pitch, in a pitch converting mechanism for an inserter machine, by providing a curved groove board for performing pitch conversion of plural mold ICs simultaneously between a mold IC pallet and an IC transfer finger.
CONSTITUTION: A board 1 having a curved groove 4 and a pallet 2 are connected while inclining thus to drop a mold IC 3 from the pallet 2. The mold IC 3 will drop along the curved groove 4. Consequently, the mold IC 3 is converted from the pitch P1 of a pallet 2 to the pitch P2 of a pitch converting board 1. With such arrangement, a high speed pitch conversion can be realized.
Inventors:
TERAJIMA SEIJI
KOIKE HIDEHO
ITO KATSUMI
KOIKE HIDEHO
ITO KATSUMI
Application Number:
JP19742385A
Publication Date:
March 17, 1987
Filing Date:
September 06, 1985
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H05K13/02; B65G11/16; B65G47/26; (IPC1-7): B65G11/16; B65G47/26; H05K13/02
Attorney, Agent or Firm:
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