Title:
ウェハレンズを成型するための金型
Document Type and Number:
Japanese Patent JP7061648
Kind Code:
B2
Abstract:
Provided is a mold for molding a wafer lens, including an upper mold and a lower mold. The upper mold includes a first molding surface. The first molding surface includes first molding portions. The first molding portion includes a first recessed portion formed by recessing from the first molding surface. The lower mold matches the upper mold. The lower mold includes a second molding surface right facing the first molding surface. The second molding surface includes second molding portions. The second molding portion includes a first protrusion portion protruding from the second molding surface towards the first molding surface. The first molding portions and the second molding portions are disposed in one-to-one correspondence. The first molding portion further includes a second recessed portion formed by recessing from the first molding surface towards a direction facing away from the lower mold. The second recessed portion surrounds the first recessed portion.
Inventors:
Peter Krone Nielsen
Niels Christian Romer Holm
▲ヂゥー▼ ▲ビン▼▲クゥー▼
Ban Masamin
Niels Christian Romer Holm
▲ヂゥー▼ ▲ビン▼▲クゥー▼
Ban Masamin
Application Number:
JP2020138274A
Publication Date:
April 28, 2022
Filing Date:
August 18, 2020
Export Citation:
Assignee:
AC Optics Solutions PTE Limited
International Classes:
B29C33/42; C03B11/08
Domestic Patent References:
| JP2010204632A | ||||
| JP2011209699A | ||||
| JP2012179768A |
Foreign References:
| US20110075264 | ||||
| CN102193115A |
Attorney, Agent or Firm:
Nishiuchi Moriji