Title:
MOLD RELEASE DEVICE
Document Type and Number:
Japanese Patent JP2023009835
Kind Code:
A
Abstract:
To provide a mold release device capable of suppressing adhesion between an extrusion pin and an extrusion plate by a binder.SOLUTION: A mold release device according to the present embodiment is a mold release device which releases a molded product formed by filling a cavity of a mold with foamed sand from the mold. The mold release device includes: an extrusion pin protruding into the cavity of the mold to extrude the molded product; a first extrusion plate having a through-hole through which the extrusion pin is inserted and a clearance provided between the extrusion pin and the through-hole; and a second extrusion plate slidably holding a bottom of the extrusion pin between itself and the first extrusion plate. The clearance is blocked by a sealing member provided to closely adhere to the first extrusion plate while covering an outer circumference of the extrusion pin.SELECTED DRAWING: Figure 3
Inventors:
ITO YOSHIYUKI
MITSUTAKE MASAOMI
MITSUTAKE MASAOMI
Application Number:
JP2021113442A
Publication Date:
January 20, 2023
Filing Date:
July 08, 2021
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
B22C9/02; B22C1/18; B22C9/06; B22C9/10
Attorney, Agent or Firm:
Ken Ieiri
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