Title:
MOLD RELEASE FILM
Document Type and Number:
Japanese Patent JP2011218588
Kind Code:
A
Abstract:
To improve the mold followability of a mold release film for a resin mold molding used in order to demold a resin from a mold after mold molding, in molding the resin using a molding apparatus.
The mold release film includes an outer surface layer consisting of a fluorine-containing polymer layer on both sides of an intermediate layer, wherein the intermediate layer is a composite layer which includes a fluorine non-containing polymer layer on both sides of a fluorine-containing polymer layer, or the mold release film includes a composite layer which includes two or more layers of each of a fluorine-containing polymer layer and a fluorine non-containing polymer layer of the intermediate layer.
Inventors:
KAWASAKI HIROYUKI
MITANI MASANORI
MATSUURA AKIRA
KAWAI NORIKAZU
HIDAKA AKINOBU
MITANI MASANORI
MATSUURA AKIRA
KAWAI NORIKAZU
HIDAKA AKINOBU
Application Number:
JP2010087460A
Publication Date:
November 04, 2011
Filing Date:
April 06, 2010
Export Citation:
Assignee:
SHIKOKU KAKO KK
International Classes:
B32B27/00; B29C33/68; B32B27/30
Attorney, Agent or Firm:
Torii Kazuhisa
Torii Hiroshi
Torii Hiroshi