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Patent Searching and Data


Title:
MOLD-RELEASING METHOD OF INORGANIC MOLDING
Document Type and Number:
Japanese Patent JPH0355207
Kind Code:
A
Abstract:

PURPOSE: To enable mold releasing to be possible without adhering the material of a kneaded substance to a mold before curing by constituting the kneaded substance contact part in a receiving part to be a press receiver for a mold of a gas permeable material, and releasing a molding from the mold while sucking it in the direction of the receiving part via the permeable material.

CONSTITUTION: A kneaded substance 11 comprising a hydraulic inorganic composition is press-molded by the use of a molding mold 14, after that, a molding 15 is released from the molding mold 14. In this instance, the kneaded substance 11 is mounted and the kneaded substance contact part 12 of a receiving part 13 to be a press receiver of the molding mold 14 is composed of a permeable material, and the molding 15 is released from the molding mold 14 while sucking it in the direction of the receiving part via the permeable material. Whereby the material of the kneaded substance 11 never adheres to the mold during the pressure molding period before curing, thus it can be released from the mold 14.


Inventors:
KUSUNOKI MITSUAKI
SUZUKI HIROSHI
MOROHASHI KENJI
Application Number:
JP19049989A
Publication Date:
March 11, 1991
Filing Date:
July 25, 1989
Export Citation:
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Assignee:
ASK CORP
International Classes:
B28B3/02; B28B13/06; (IPC1-7): B28B3/02; B28B13/06
Attorney, Agent or Firm:
Hidetoshi Mitsuishi (1 person outside)