To provide a mold releasing sheet for semiconductor mold which prevents the adhesion of foreign materials due to sealing material or the like for the mold releasing sheet upon molding a semiconductor package utilizing the sheet.

In the mold releasing type sheet for semiconductor mold constituted of an antistatic layer laminated on one side of a plastic film consisting of one layer or more than two layers. A mold releasing layer provided on the antistatic layer or an antistatic agent containing mold releasing layer provided on the antistatic layer, the surface inherent resistance value of the surface of mold releasing layer is preferable to be not more than 1×1013Ω/sq.. According to this constitution, the adhesion of foreign materials to a package is prevented and, further, burr, caused by biting of the foreign materials between the mold releasing sheet and a lead frame can be prevented whereby the improvement of the productive efficiency of the package can be desired.