Title:
Mold structure
Document Type and Number:
Japanese Patent JP5945173
Kind Code:
B2
Inventors:
Kei Igasaki
Okuma light
Katsuhiko Takakura
Okuma light
Katsuhiko Takakura
Application Number:
JP2012145958A
Publication Date:
July 05, 2016
Filing Date:
June 28, 2012
Export Citation:
Assignee:
Taisei Corporation
International Classes:
B28B7/26; B28B23/04; E04G21/12
Domestic Patent References:
JP55133907A | ||||
JP62183310A | ||||
JP57202545U |
Attorney, Agent or Firm:
Isono International Patent and Trademark Office
Isono Dozo
Etsuo Tada
Nosho Machida
Isono Dozo
Etsuo Tada
Nosho Machida