Title:
Mold structure
Document Type and Number:
Japanese Patent JP6039933
Kind Code:
B2
Inventors:
Katsuhiko Takakura
Kei Igasaki
Okuma light
Kei Igasaki
Okuma light
Application Number:
JP2012145952A
Publication Date:
December 07, 2016
Filing Date:
June 28, 2012
Export Citation:
Assignee:
Taisei Corporation
International Classes:
B28B23/04; E04G21/12
Domestic Patent References:
| JP2001277232A | ||||
| JP2003220604A | ||||
| JP2009279758A |
Foreign References:
| US3903222 |
Attorney, Agent or Firm:
Isono International Patent and Trademark Office
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