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Title:
MOLD THERMOSTAT
Document Type and Number:
Japanese Patent JP2012045872
Kind Code:
A
Abstract:

To provide a mold thermostat capable of improving heat efficiency by decreasing one amount of a medium recovered by switching high/low temperature media.

The mold thermostat 1 includes a high-temperature medium supply part 2, a low-temperature medium supply part 3, a medium-feeding side switching connection part 4 and a medium-returning side switching connection part 5 near a mold 8, a high-temperature medium storage part 20, a low-temperature medium storage part 30, a recovered medium storage part 60, and a pipe line. After a control part changes a mold heating state to a heating/cooling switching state in which a low-temperature medium sending route 14, the pipe line, a recovered medium storage part 60, and the low-temperature medium storage part 30 are communicated/connected, the control part switches the state to a mold cooling state. On the other hand, after the control part changes the mold cooling state to a cooling/heating switching state in which a high-temperature medium sending route 11, the pipe line, a recovered medium storage part 60, and the high-temperature medium storage part 20 are communicated/connected, the control part switches the state to the mold heating state.


Inventors:
METSUGI MASAAKI
SHIMIZU MOTOHARU
Application Number:
JP2010191770A
Publication Date:
March 08, 2012
Filing Date:
August 30, 2010
Export Citation:
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Assignee:
MATSUI MFG CO
International Classes:
B29C45/73; B29C45/78
Domestic Patent References:
JP2005329577A2005-12-02
JP2003145599A2003-05-20
JPH0584747A1993-04-06
JP2006110905A2006-04-27
JP2005225042A2005-08-25
JP2010110989A2010-05-20
Foreign References:
WO2009001485A12008-12-31
Attorney, Agent or Firm:
Hiroyuki Nakai
Okumura Kimitoshi