Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOLD
Document Type and Number:
Japanese Patent JP2011046196
Kind Code:
A
Abstract:

To provide a mold wherein a corona generating voltage is high, and an interval between metal sheets is small, and the assembling work thereof is easy.

For the mold, an adhesive material layer 1 is installed on both surfaces of an insulating polymer film 2, and a sheet-like metal body 3 is respectively bonded to each adhesive material layer 1. At the same time, those both surfaces are molded with an external layer insulating polymer 6. When the sheet-like metal body 3 is bonded to the insulating polymer film 2, the bonding is performed in such a manner that the end sections 5 of the sheet-like metal body 3 may be covered with an adhesive material, and then, the peripheries of the bonded articles are molded with the external layer insulating polymer 6.


Inventors:
IWASAKI SHU
YAMAZAKI TAKANORI
TAKI TAKEYOSHI
Application Number:
JP2010195253A
Publication Date:
March 10, 2011
Filing Date:
September 01, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI CABLE
International Classes:
B29C43/18; B29C65/52; B32B15/08; H01B17/56; H01B19/00; B29L31/34
Domestic Patent References:
JP2008030392A2008-02-14
JP2005032465A2005-02-03
JP2001196741A2001-07-19
Attorney, Agent or Firm:
Hiroshi Okikawa