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Patent Searching and Data


Title:
MOLDED COMMUTATOR
Document Type and Number:
Japanese Patent JPH05258825
Kind Code:
A
Abstract:

PURPOSE: To form an irregular groove over entire length and a peripheral groove for increasing bonding strength with resin via the application of cold molding and machining to the surface of a bush.

CONSTITUTION: The external surface of a bush 4 is pressed all around with a jig shorter than the length thereof, thereby forming an irregular groove. Peripheral and axial bonding strength between a molded resin material 3 and the bush 4 is increased, due to a stepped section 5c between the irregular groove and an axial un-machined section. As a result, an inexpensive un-machined tube can be used, and a material can be saved at a cold molding process. Also, a cold molding machine and a machining facility can be eliminated, requiring only a simple pressing machine. Also, a manufacturing process can be shortened, because of the elimination of a machining process.


Inventors:
Satoru Umeki
Application Number:
JP5628991A
Publication Date:
October 08, 1993
Filing Date:
March 20, 1991
Export Citation:
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Assignee:
株式会社日立製作所
株式会社河村製作所
International Classes:
H01R39/04; H01R43/06; (IPC1-7): H01R39/04; H01R43/06
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)