Title:
MOLDED FOAM BODY, AND METHOD FOR INCREASING SOUND TRANSMISSION LOSS
Document Type and Number:
Japanese Patent JP2018028108
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a molded foam body that improves the damping and sound insulation properties of a panel and achieves the weight reduction of the panel; and a method for increasing sound transmission loss.SOLUTION: The present invention relates to a molded foam body of a resin composition comprising: a block copolymer (I) which has a polymer block (A) chiefly consisting of a structural unit derived from an aromatic vinyl compound and another polymer block (B), and which conforms to JIS K7244-10 (2005), and which has a peak top temperature of tanδ of -50°C to 50°C, as measured under the conditions of 1 mm in test piece thickness, 0.1% in distortion amount, 1 Hz in frequency, -70°C to 70°C in measurement temperature, and 3°C/min in temperature increase rate, and which has a peak top molecular weight of 30,000-500,000; at least one olefin polymer (II) selected from the group consisting of ethylene- propylene-diene copolymer rubbers, ethylene-vinyl acetate copolymers, and polyethylene resins; a cross-linking agent (III); and a foaming agent (IV).SELECTED DRAWING: None
Inventors:
MORISHITA YOSHIHIRO
KATO MASAHIRO
SENDA YASUSHI
ARISHIMA HIROYUKI
KOISHIKAWA ATSUSHI
KATO MASAHIRO
SENDA YASUSHI
ARISHIMA HIROYUKI
KOISHIKAWA ATSUSHI
Application Number:
JP2017227860A
Publication Date:
February 22, 2018
Filing Date:
November 28, 2017
Export Citation:
Assignee:
KURARAY CO
International Classes:
C08J9/04; C08K3/06; C08K3/30; C08K5/14; C08L23/08; C08L23/10; C08L23/16; C08L53/02
Domestic Patent References:
| JP2003306567A | 2003-10-31 |
Foreign References:
| WO2003035705A1 | 2003-05-01 | |||
| WO2011040586A1 | 2011-04-07 | |||
| WO2004003027A1 | 2004-01-08 |
Other References:
石井正雄: "スチレン系熱可塑性エラストマーの特性と応用", 日本ゴム協会誌, vol. 第７０巻 第１２号（１９９７）, JPN6021009609, 1997, JP, pages 707 - 714, ISSN: 0004471579
Attorney, Agent or Firm:
Arinaga Shun