MOLDED PIECE HAVING TRANSFER LAYER AND ITS MANUFACTURE

Title:

MOLDED PIECE HAVING TRANSFER LAYER AND ITS MANUFACTURE

Document Type and Number:

Japanese Patent JP3226605

Kind Code:

B2

Abstract:

PURPOSE: To provide a molded piece having a transfer layer wherein the transfer layer is free from generation of crack, strain, deformation, etc., and stuck to an adhesive layer by strong adhesive strength and its manufacturing method by a method wherein flow and deformation of the adhesive layer by a thermosetting resin are avoided from occurring by thermocompression when the transfer layer in a sheet for transfer is transferred to the adhesive layer by the thermosetting resin formed on the surface to be transferred.
CONSTITUTION: A molded piece having a transfer layer to be obtained by a process wherein an applied layer of thermosetting resin is formed on a surface to be transferred of a molded piece being a material to be transferred, a process wherein a noncohesive solid layer of an unhardened state is obtained by drying the applied layer by fingering, a process wherein a transfer layer surface of the sheet for transfer consisting of a transfer sheet base material and a transfer layer is brought into contact with the non-cohesive solid layer surface, a process wherein a superposed material of the material to be transferred and the sheet for transfer is heated and pressurized, and a process wherein the transfer sheet base material is separated.

Inventors:

Takashi Tarutani
Katsuhiko Taki

Application Number:

JP15880592A

Publication Date:

November 05, 2001

Filing Date:

May 26, 1992

Export Citation:

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