Title:
成形はんだ及び成形はんだの製造方法
Document Type and Number:
Japanese Patent JP7386826
Kind Code:
B2
Abstract:
To provide molding solder capable of inhibiting a Cu/Sn-based compound from being formed by frictional heat generated during rolling, and a method of manufacturing the molding solder.SOLUTION: Molding solder is formed by rolling a mixture of a plurality of kinds of metallic powders. The mixture of the plurality of kinds of metallic powders includes at least one of a copper powder having a coat made of nickel or an alloy including nickel and a copper alloy powder having a coat made of nickel or an alloy including nickel, and a powder of an alloy including tin.SELECTED DRAWING: Figure 1
Inventors:
Isao Sakamoto
Application Number:
JP2021045870A
Publication Date:
November 27, 2023
Filing Date:
March 19, 2021
Export Citation:
Assignee:
Tamura Manufacturing Co., Ltd.
International Classes:
B23K35/14; B23K35/26; B23K35/40; C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22C9/06; C22C19/03
Domestic Patent References:
| JP2002301588A | ||||
| JP2018204047A | ||||
| JP201381966A | ||||
| JP202055032A | ||||
| JP6042577B2 |
Foreign References:
| WO2007125861A1 |
Attorney, Agent or Firm:
Youko Ohta