Title:
熱伝導性ポリマーを含んでなる成形熱可塑性物品
Document Type and Number:
Japanese Patent JP2014503658
Kind Code:
A
Abstract:
Disclosed are molded thermally conductive thermoplastic articles having low light reflectance, comprising thermoplastic polymers blended with thermally conductive fillers and carbon black powders. The polymer blends are characterized by a unique combination of high thermal conductiveness and low light reflectance. The molded articles in which such properties are desirable include, without limitation, a chassis structure for electrical and electronic devices wherein a light source is constructed inside and wherein heat is generated in the light source so as to be dissipated to an ambient atmosphere.
Inventors:
Yuji Saga
Application Number:
JP2013546353A
Publication Date:
February 13, 2014
Filing Date:
December 20, 2011
Export Citation:
Assignee:
E.I.DU PONT DE NEMOURS AND COMPANY
International Classes:
C08L101/00; C08K3/04; C08K3/16; C08K3/22; C08K3/26; C08K7/14; C08L25/06; C08L67/00; C08L69/00; C08L71/12; C08L77/00
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office