To prevent wires from being exposed on the outermost peripheral surface of the resin coated layer of a molded wire harness, by holding a group of wires arranged for wiring at a center position, in a bent groove in a branching die.

In this wire harness, a large number of wires are branched to a plurality of wires from an integrated branch part, and the group of the wires except for those in the vicinity of the connectors at the terminals of these branched wires are inserted in the grooves of a molding die and are molded by resin mold in an arranged wiring form. The bent groove in the branching die is recessed so as to have a rectangular cross section, and a projecting part having a V-shaped cross section is projected from the side wall on the inner periphery side of the groove. The group of wires inserted in the groove are prevented from being inserted along the inner peripheral surface of the groove by the projecting part, the side part of a protector having a L-shaped cross section is set in the groove so as to be positioned on the outer periphery side and on the bottom surface, and the protector is molded together with the group of wires by resin.