To provide a molding apparatus that can heat a molding part with a simple composition while securing durability of the molding part in a mold and a molding method by the molding apparatus.

The molding apparatus 100 includes a first mold 110 and a second mold 120 that perform mold processing of the product PR to be a molding object. In the first mold 110 and the second mold 120, a first molding part 111 and a second molding part 121 are formed at a central part of the mutually opposing surfaces. In the first molding part 111 and the second molding part 121, the three-dimensional shapes corresponding to the surface shape of product PR are formed respectively. Heat-insulation insulators 113 and 124 are provided for surroundings of the first molding part 111 and the second molding part 121 in the first mold 110 and the second mold 120. Moreover, the first mold 110 and the second mold 120 are connected with a power supply device 136 through input/output electrodes 132 and 133, and are electrically connectably or disconnectably by connection electrodes 134 and 135.