型を用いて基板上の組成物を成形する成形装置、成形方法、および物品の製造方法

Title:

型を用いて基板上の組成物を成形する成形装置、成形方法、および物品の製造方法

Document Type and Number:

Japanese Patent JP7237519

Kind Code:

B2

Abstract:

To provide a molding device capable of reducing vibration of a mold.SOLUTION: A molding device that molds a composition on a substrate using a mold includes: a mold holding unit that holds and moves the mold; a substrate holding unit that holds and moves the substrate; and a control unit that performs control so as to perform first movement to move the mold holding unit or the substrate holding unit in a first direction which is a direction in which the mold and the composition are separated from each other, from a state in which the mold held by the mold holding unit and the composition on the substrate held by the substrate holding unit are in close contact with each other, and second movement to move the mold holding unit or the substrate holding unit in a second direction which is a direction in which the mold and the composition approach each other, in a state in which the mold and the composition are separated.SELECTED DRAWING: Figure 3

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Inventors:

Norifumi Hosaka

Application Number:

JP2018201265A

Publication Date:

March 13, 2023

Filing Date:

October 25, 2018

Export Citation:

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Assignee:

Canon Inc

International Classes:

H01L21/027; B29C39/10; B29C39/24

Domestic Patent References:

JP2013070023A
JP2015056598A
JP2011529626A
JP2016219679A
JP2018067606A
JP2013207180A

Foreign References:

US20160129612

Attorney, Agent or Firm:

Takuma Abe
Sougo Kuroiwa

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