Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOLDING APPARATUS
Document Type and Number:
Japanese Patent JP2002086426
Kind Code:
A
Abstract:

To provide a molding apparatus enabling stable release or transfer of a molded body after compression molding in the case when an air supply passage for ensuring an air flow for dewatering is provided.

In the molding apparatus 1, a molding material S1 is injected into a cavity formed between the respective molding surfaces 4a and 5a of top and bottom forces 4 and 5 disposed above and below and the molding material is compressed by clamping these forces 4 and 5, while the water contained in the molding material S1 is sucked and removed. The molding surface 4a of the top force 4 is provided with openings 40 for extracting and sucking the water which function to dewater and deaerate the injected molding material S1 and also to suck and hold the molded body with vacuum for release or transfer of the molded body obtained after molding. The molding apparatus 1 is provided besides with the air supply passage 45 which ensures the air flow for dewatering and can be shut off or regulated for the air flow by a solenoid valve 46 or the like.


Inventors:
ISONO KEIJI
Application Number:
JP2000280205A
Publication Date:
March 26, 2002
Filing Date:
September 14, 2000
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
B28B3/02; B28B13/06; (IPC1-7): B28B3/02; B28B13/06