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Title:
MOLDING APPARATUS
Document Type and Number:
Japanese Patent JPS5450069
Kind Code:
A
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Inventors:
UCHIOKE MASAO
SEKINE HARUHIKO
Application Number:
JP11589277A
Publication Date:
April 19, 1979
Filing Date:
September 27, 1977
Export Citation:
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Assignee:
SEIKOSHA KK
International Classes:
B29C45/00; B29B13/00; B29C33/00; B29C33/44; B29C41/00; B29C45/26; B29C45/43; (IPC1-7): B29C7/00; B29F1/14
Domestic Patent References:
JP49099855B



 
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