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Title:
MOLDING COMPOSITION AND MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2002047422
Kind Code:
A
Abstract:

To obtain a molding composition which is a material for molding a molded product having excellent rigidity and impact resistance, and furthermore can be easily molded or is easy to mold, and a molded product using the molding composition.

The molding composition has a synthetic wax and an ethylene based copolymer as the major components, and the molded product uses this composition.


Inventors:
SAKAMOTO ETSUO
Application Number:
JP2000234463A
Publication Date:
February 12, 2002
Filing Date:
August 02, 2000
Export Citation:
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Assignee:
PEGASUS CANDLE CO LTD
International Classes:
C08J5/00; B29C39/02; C08L23/06; C08L23/08; C08L91/06; (IPC1-7): C08L91/06; B29C39/02; C08J5/00; C08L23/06; C08L23/08
Domestic Patent References:
JPS63291955A1988-11-29
JPS6218452A1987-01-27
JPS61252254A1986-11-10
JPH07138484A1995-05-30



 
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