Title:
MOLDING DEVICE
Document Type and Number:
Japanese Patent JPH0938992
Kind Code:
A
Abstract:
To clean a divided surface of a stationary mold and a movable mold completely with high efficiency in resin injection molding.
A pressure sensitive adhesive double coated sheet 46 is inserted between a stationary mold 11 and a movable mold 12, a mold is closed, and staining on the divided surfaces 11a, 12a is transferred onto the pressure sensitive adhesive double coated sheet 46. The mold is then closed, and the pressure sensitive adhesive double coated sheet 46 is taken out. For the conveyance of the pressure sensitive adhesive double coated sheet 46, a taking-out device is utilized. It is thus possible to remove adhesion staining due to resin gas completely.
Inventors:
OBARA MITSUHIRO
Application Number:
JP19991095A
Publication Date:
February 10, 1997
Filing Date:
August 04, 1995
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B29C33/72; B29C45/17; (IPC1-7): B29C33/72; B29C45/17
Attorney, Agent or Firm:
Ushiki Mamoru (1 person outside)
Next Patent: FERRULE MOLDING METHOD