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Title:
MOLDING DIE FOR CHIP-MOLDED MOLDING
Document Type and Number:
Japanese Patent JP2008126503
Kind Code:
A
Abstract:

To enable the take-out of a shaped, chip-molded molding to be done simply and enable the cleaning of the die inside to be done easily.

The molding die M has the first molding die 30 provided with the first molding face 32 that shapes a molding molded with chips, the intermediate die 40 that has the insertion space 42 aligned with the first molding face 32 and defines the cavity C by detachably contacting the first molding die 30, and the second molding die 50 that has the second molding face 52 to shape the chip-molded molding and slides along the insertion space 42 of the intermediate die 40. The chip-molded molding, which is formed by compression molding with the first molding face 32 of the first molding die 30 on which the intermediate die 40 is brought into contact and the second molding face 52 of the second molding die 50 which is inserted in the intermediate die 40, can simply be taken out by detaching the intermediate die 40 and the second molding die 50 from the first molding die 30.


Inventors:
HOSHINO AKANE
SASAO TAKUHIRO
Application Number:
JP2006313362A
Publication Date:
June 05, 2008
Filing Date:
November 20, 2006
Export Citation:
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Assignee:
INOUE MTP KK
International Classes:
B29C43/36; B29C43/42
Domestic Patent References:
JPS6071215A1985-04-23
JP2006069133A2006-03-16
Attorney, Agent or Firm:
Kiiku Yamamoto