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Title:
MOLDING DIE FIXING DEVICE, CASTING DEVICE AND MOLDING DEVICE
Document Type and Number:
Japanese Patent JP2008246902
Kind Code:
A
Abstract:

To provide a molding die fixing device which shows excellent operability during fixing a molding die to the specified position of a mold fixture and likewise, excellent operability during removing the molding die from the mold fixture, and a casting device and a molding device which are capable of manufacturing a roller with superb dimensional precision.

The molding die fixing device 1 is equipped with the mold fixture 20 for fixing the molding die 100 configured of end parts blocking both end openings of a cylindrical mold. The mold fixture 20 has at least, two contact surfaces which come into contact with the molding die 100, and is fitted to the molding die fixing device 1 so as to allow the contact surfaces to assume a perpendicular position. At least, either the mold fixture 20 or the cylindrical mold, is formed of a hard magnetic material, while the other is formed of a hard magnetic material or a soft magnetic material. Also, the casting device and the molding device are each equipped with the molding die fixing device 1.


Inventors:
MORI HIDEO
IWAKI SHUJI
Application Number:
JP2007092147A
Publication Date:
October 16, 2008
Filing Date:
March 30, 2007
Export Citation:
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Assignee:
SHINETSU POLYMER CO
International Classes:
B29C33/32; B29C45/64
Domestic Patent References:
JP2006116774A2006-05-11
JP2006142650A2006-06-08
JPH11207760A1999-08-03
JP2003154436A2003-05-27
JPH0825423A1996-01-30
Attorney, Agent or Firm:
Ikuo Shinoda
Naoki Fukumura