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Patent Searching and Data


Title:
MOLDING DIE
Document Type and Number:
Japanese Patent JPS5845935
Kind Code:
A
Abstract:

PURPOSE: To manufacture a molded piece having an undercut part by a comparatively simple structure wherein a knockout pin is projected at an undercut molded part to separate the molded piece.

CONSTITUTION: After synthetic resin is injected into a cavity and molded, a movable die 3 is driven and opened and a block die 4 is lifted by a driving means 17 through an upper and a lower plate 15, 16. The undercut molding part 7 of the block die 4 projects slightly from the cavity of the fixed die 1. Then, a knockout pin 9 is projected by driving an ejector plate 20 from a guide hole 8 and a molded piece 6 is separted by elastic deformation from the under- cut molding part 7. In this way the molded piece having the under-cut part is manufactured simply without using a slide core of complicated structure or the like.


Inventors:
NOGUCHI KOUJI
Application Number:
JP14492681A
Publication Date:
March 17, 1983
Filing Date:
September 14, 1981
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B29C45/00; B29B13/00; B29C33/00; B29C33/22; B29C33/38; B29C33/44; B29C41/00; B29C45/37; B29C45/44; (IPC1-7): B29C1/00; B29F1/022
Attorney, Agent or Firm:
Ishida Choshichi