PURPOSE: To obtain a method for molding an electronic apparatus in which continuous productivity is improved.
CONSTITUTION: A conductor pattern is formed in molds 1 and 4, and a conductor part 5 of the pattern is a laminate in which a copper-plated layer 51 is laminated through a solder layer 52. When resin is injected from a gate 3 at the time of molding, a temperature gradient occurs in the laminated copper-plated layer and solder layer since a heater 2 is provided, and a temperature of the plated and solder layers of a surface layer becomes higher than that of the inner layer. The layers 52 are peeled one by one from the surface layer, transferred together with the layer 51 to molding resin, the pattern is transferred simultaneously upon molding, and molding for obtaining an electronic apparatus can be continuously conducted.
HAYASHI OSAMU
ADACHI EINOSUKE
