Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOLDING FOR LIGHT PHOTOSENSITIVE MATERIAL AND PHOTOSENSITIVE MATERIAL PACKAGE USING THE SAME
Document Type and Number:
Japanese Patent JP2003248288
Kind Code:
A
Abstract:

To obtain a molding for a photosensitive material which is molded by using a resin for molding exceeding 50:50 in the constitution ratio of cellulosic fibers derived from paper and a fully thermoplastic resin containing a thermoplastic elastomer and has excellent rigidity, impact strength and ultrasonic workability and a photosensitive material package.

The molding for the photosensitive material is molded in such a manner that the composition ratio of the cellulosic fibers derived from the paper and the fully thermoplastic resin containing the thermoplastic elastomer attains a range from 51:49 to 75:25, in which the content of the thermoplastic elastomer is 0.5 to 8 mass% of the total of the fully thermoplastic resin containing the cellulosic fibers and the thermoplastic elastomer and the photosensitive material package using the same.


Inventors:
ENOMOTO MASAHIRO
Application Number:
JP2002047569A
Publication Date:
September 05, 2003
Filing Date:
February 25, 2002
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03C3/00; B65D85/672; C08J5/00; C08L1/02; (IPC1-7): G03C3/00; B65D85/672; C08J5/00; C08L1/02
Attorney, Agent or Firm:
Yasuhiro Noguchi