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Patent Searching and Data


Title:
MOLDING MACHINE FOR SYNTHETIC RESIN PACKAGE IN ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH11176854
Kind Code:
A
Abstract:

To make releasing easier after molding without complicating the construction by reducing the angle of the draft on side face in each cavity equipped with a raw material resin charging chamber and plunger and also increasing the angle of the draft at side face in each cavity of dies not equipped with a charging chamber.

A lower die 2 of two dies 1, 2 has a raw material resin charging chamber 3 in such a manner that it directly opens inside a cavity 2a for package body molding at each place of cavity 2a for each package molding. Also, at inner side faces 1a', 2a' in cavities 1a, 2a for each package molding of both dies 1, 2, drafts of adequate angles θ1 and θ2 are provided, in this case, angle θ1 of the draft at the inner side face 1a' in the cavity 1a for each package molding of the upper die 1 is made larger, and the draft angle θ2 at the inner side face 2a' of the cavity 2a for each package molding of the lower die 2 is made smaller.


Inventors:
NAKAMURA NOBUYUKI
Application Number:
JP33860197A
Publication Date:
July 02, 1999
Filing Date:
December 09, 1997
Export Citation:
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Assignee:
ROHM CO LTD
International Classes:
B29C45/32; B29C45/02; B29C45/14; B29C45/22; B29C45/40; H01L21/56; B29L31/34; (IPC1-7): H01L21/56; B29C45/02; B29C45/14; B29C45/22; B29C45/32; B29C45/40
Attorney, Agent or Firm:
Akio Ishii (2 outside)