MOLDING MATERIAL FOR INTEGRATED CIRCUIT CASE

Title:

MOLDING MATERIAL FOR INTEGRATED CIRCUIT CASE

Document Type and Number:

Japanese Patent JPH0493344

Kind Code:

A

Abstract:

PURPOSE:To provide the title material which is antistatic and hardly affected by an external dynamic electricity by selecting a molding material comprising a specific fiber and a specific thermoplastic resin and having a specified surface resistivity. CONSTITUTION:A molding material comprising a fiber obtd. by cutting a polyacrylonitrile-derived carbon fiber having a vol. resistivity of 1X10<1>-3X10<-2>OMEGA.cm and at least one thermoplastic resin selected from the group consisting of a nylon, an acrylonitrile-butadiene-styrene resin, and a polyethylene terephthalate resin and having a surface resistivity of 1X10<4>-1X10<7>OMEGA is selected.

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Inventors:

HABASAKI MASAHIRO
MOCHIZUKI KAZUOKI
TSUNEKAWA HIROSHI

Application Number:

JP21205390A

Publication Date:

March 26, 1992

Filing Date:

August 10, 1990

Export Citation:

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Assignee:

TOHO RAYON KK

International Classes:

B29B11/16; C08K7/06; C08L55/00; C08L55/02; C08L67/00; C08L67/02; C08L77/00; D01F9/22; (IPC1-7): B29B11/16; C08K7/06; C08L55/02; C08L67/02; C08L77/00; D01F9/22

Attorney, Agent or Firm:

Doi Saburo

Next Patent: JPS493345