Title:
MOLDING MATERIAL, MOLDED ARTICLE, AND METHOD FOR PRODUCING THE SAME, AND HOUSING FOR ELECTRIC ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2011132462
Kind Code:
A
Abstract:
To provide a molding material which has rigidity, flexural strength, heat resistance, moldability, impact resistance, and chemical resistance.
The molding material comprises a cellulose derivative containing at least one group obtained by replacing the hydrogen atom of a hydroxyl group contained in the cellulose by (A) a hydrocarbon group: -RA and at least one group obtained by replacing the hydrogen atom of a hydroxyl group by (B) an acyl group: -CO-RB (RB is a hydrocarbon group), and a polyoxymethylene-based resin.
Inventors:
YOSHITANI SHUNEI
KAMIHIRA SHIGEO
KAMIHIRA SHIGEO
Application Number:
JP2009295100A
Publication Date:
July 07, 2011
Filing Date:
December 25, 2009
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
C08L1/08; C08B13/00; C08L59/02
Attorney, Agent or Firm:
Takeshi Takamatsu
Kiyozumi Yazawa
Kiyozumi Yazawa