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Patent Searching and Data


Title:
MOLDING METHOD OF COMPOUND INSULATOR AND METAL MOLD DEVICE USED THEREFOR
Document Type and Number:
Japanese Patent JPH10188707
Kind Code:
A
Abstract:

To provide a compound insulator molding method and a metal mold device used therefore which enable obtaining a good product by ending molding and vulcanizing in a short time without exerting an adverse effect on the product.

A molding method of a high polymer molded unit is constituted such that in a compound insulator molding metal mold 1, a core member 3 having a flange metal fitting 2 in both ends is arranged, a casing forming space 4 around the core member 3 is filled with a casing forming material 5, thereafter it is hardened. Here, in the case of hardening a molded unit, by additionally providing a new heating means 6 in the vicinity of the flange metal fitting 2, a temperature rise of the casing forming material 5 in the vicinity of the flange metal fitting 2 is generated up to a temperature rise of the casing forming material 5 in the other part.


Inventors:
KASHIWAGI HIROSHI
Application Number:
JP35010796A
Publication Date:
July 21, 1998
Filing Date:
December 27, 1996
Export Citation:
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Assignee:
NGK INSULATORS LTD
International Classes:
B29C39/26; B29C33/02; B29C39/10; B29C39/38; B29C43/18; H01B19/00; B29C35/02; B29L31/34; (IPC1-7): H01B19/00; B29C39/10; B29C39/26; B29C39/38
Attorney, Agent or Firm:
Akihide Sugimura (9 outside)