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Title:
MOLDING METHOD AND MOLDING DEVICE
Document Type and Number:
Japanese Patent JP2010221264
Kind Code:
A
Abstract:

To reduce warpage during molding in a molding method and a molding device.

Polygonal-pyramid recesses (2b) are formed in an arrangement where polygonal openings (2b1) of polygonal-pyramid recesses (2b) and polygonal-shaped planes (2c) arranged adjacent to the polygonal openings (2b1) are arranged in a flat surface filling state with respect to a plate body (2). Polygonal-pyramid small recesses (2d) having polygonal small openings (2d1) smaller than the polygonal openings (2b1) and having a depth shallower than those of the polygonal-pyramid recesses (2b) are formed at the planes (2c).


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Inventors:
SUZUKI HARUO
MUNAKATA KENJI
GOSHIMA ISAO
Application Number:
JP2009071895A
Publication Date:
October 07, 2010
Filing Date:
March 24, 2009
Export Citation:
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Assignee:
SHIROYAMA KOGYO KK
International Classes:
B21D22/02; B21D47/00
Attorney, Agent or Firm:
Kamei Takeyuki



 
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